We have more than 13 years experience in manufacturing modern electronic modules and complete systems. This makes us a reliable partner for various industrial segments such as entertainment, automotive, medical, Hi-Tech and IT/T industry.
We are ISO 9001:2000 certified.

Capability range

• Components shaping
  1. Forming thru-hole components to various shapes using automatic shaping machines
  2. Thru-hole components shortening
• Heat-sink assemblies
  1. Various types of heat-sink assemblies mounting
  2. Components screwing and bonding
• SMD assembling
  1. Using curing process (glue dispensing + curing owen)
  2. Using reflow process (solder paste + reflow owen)
• AOI – automatic optical inspection
  1. Guarantee of 100% optical check of correctness and accuracy of automatic and manual components placement using camera optical systems
• Thru-hole components assembling
  1. Assembling of large and sophisticated electronic systems under attendance of our skilled specialists
  2. Manual soldering of difficult components
• Wave soldering
  1. Automatic wave soldering technology under nitrogene
  2. Guarantee of unleaded soldering (RoHS)
  3. Specific shape products soldering using solder frames and solder masks
• Functional and ICT testing
  1. Preparation and design of testing devices and units based on output parameters of device and test requirements
  2. Usage of dedicated and universal testing devices
• Special technologies and services
  1. Varnishing
     1. Automatic varnish application on PCB for purpose of protection against the air humidity using automatic varnishing machine
     2. Curing and drying of varnish mask
  2. Soaking bath
     1. Automatic soaking of PCBA in plastic or metal housing using epoxide- or resin-based substances
     2. Guarantee of exact automatic batching
  3. Laser engraving
     1. Descriptions, codes and logos engraving using automatic LASER device TRUMPF
  4. Labels printing
     1. Thermo-print – identification (BCR, typical) labels printing using thermo-printers
     2. Various types of labels printing (paper, plastic, etc.)
  5. IC circuits programming
     1. Preparation and uploading programs in the IC components
• Final assemblies
  1. Assembly of electronic components and parts (PCBA) with plastic and metal parts
  2. Finalization, programming and testing of complex final products
• Module and final products packaging
  1. Design of optimal packaging for safe transport of products
  2. Products packaging for end-user distribution chain
• Development
  1. Optimalization proposals and development
  2. Development and production of plastic and metal housings
  3. Development and production of packaging and product user´s manuals
  4. Prototypes manufacturing

Production facilities

• SMD assembling
  1. 4 fully automatic SMD assembly lines capable for curing and reflow processes
  2. average capacity 100 000 components per hour, in case of maximum load of all assembly lines 200 000 components per hour
  3. various component size assembling from size 0402, BGA devices
  4. 3-shifts working avaliable
  5. 2 lines equiped with SIEMENS Siplace
  6. 2 lines equiped with PANASONIC MSR
  7. reflow owens ERSA Hotflow 7, 9, REHM
  8. X-Ray Teradyne automated inspection
  9. PMJ HISAC 1500 radial assembly cell
• THT assembling
  1. 3 conveyer manual assembly lines
  2. 3 ATF wave soldering machines with soldering under nitrogene
  3. 3-shifts working avaliable
• LASER (engraving and labelling)
  1. TRUMPF VectorMark VW800R
• Automatic varnishing machine
  1. NORDSON C708

Products portfolio

We produce also :

• Dimmers
• Battery chargerse
• Modules for usage in explosive environment
• Electronic modules for automotive industry
• Printer´s controllers
• ISDN telephone devices
• Electronic door opener systems
• GSM/UMTS components
• GPS components
• Alarm devices
• Satellite technics modules
• Components for Hi-Fi and TV-technics
• Medical devices (for example modules for respirator unit)
• ... and also your products soon!

In future we plan:

We are continuously working on inovations for our customers and improving all the processes to successfully compete within the market in future.